亚马逊AR Analyst-Japan
任职要求
基本任职资格 - Speak, write, and read fluently in Japanese - Experience with Microsoft Office products and applications 优先任职资格 - 3+ years of finance operations/shared services, accounts payable, account receivable (collections) or general ledger experience Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you hav…
工作职责
Amazon's Finance Operations department seeks JP AR analyst for collection related process. The responsibilities are includes: 1. Be responsible for JP AR related daily transactions and AR collection process for Amazon business. 2. Implement AR collection process with related tools, drive process improvement and system automation projects. 3. Analyzing data provided by different tools and systems for financial purpose 4. Other works assigned by manager.
Amazon's Finance Operations department seeks JP AR analyst for collection related process. The responsibilities are includes: 1. Be responsible for JP AR related daily transactions and AR collection process for Amazon business. 2. Implement AR collection process with related tools, drive process improvement and system automation projects. 3. Analyzing data provided by different tools and systems for financial purpose 4. Other works assigned by manager.
Amazon's Finance Operations department seeks JP AR analyst for collection related process. The responsibilities are includes: 1. Be responsible for JP AR related daily transactions and AR collection process for Amazon business. 2. Implement AR collection process with related tools, drive process improvement and system automation projects. 3. Analyzing data provided by different tools and systems for financial purpose 4. Other works assigned by manager.
1、嵌入式AI系统开发: • 负责RTOS系统平台上多模态AI终端产品的研发,包括方案评估、软件架构设计、核心功能模块(如人脸/手势识别、行为分析)开发与部署; • 主导端侧AI模型轻量化、跨平台推理框架适配(TensorFlow Lite/MNN/NCNN)及NPU芯片的性能优化(如内存、功耗、实时性); • 结合硬件特性设计轻量化模型架构,完成从算法训练到嵌入式端侧部署的全链路开发。 2、多模态算法工程化: • 优化计算机视觉算法在嵌入式设备(IoT/AR硬件/AI机器人)的落地效果,解决低算力、高延迟、多干扰场景下的工程挑战; • 开发芯片算子库适配方案,参与芯片选型、AI工具链优化及端云协同架构设计; • 探索多模态交互(视觉+语音+传感器)在智能终端的创新应用,如AI玩偶、陪伴机器人等。 3、跨团队协作与交付: • 与芯片厂商、算法团队、硬件团队协同开发,主导端侧SDK集成及性能调优,确保产品按时交付; • 支持产品量产落地,保障系统稳定性与用户体验。