地平线IC Packaging Thermal Expert

任职要求

As a successful candidate, you must exhibit the following behavioral traits: Interpersonal, communication, problem solving and analytical skills. Comfortable working independently in a fast-paced environment. 
Minimum Qualifications: 
	Master's degree/above in thermal Engineering or related and 5+ years of technical experience with IC package thermal solution simulation
	Exp…

工作职责

In this position, you will be a member of the IC packaging development team in Horizon. With your technical background in thermal engineering, you will be responsible for FCBGA/MCM/FOP thermal solution enablement including thermal simulation, thermal characterization and modeling calibration. You will also work with different teams to help setup thermal test platform if needed. As a key contributor in the IC packaging development team, you will work closely with partner groups and organizations, including OSAT, material vendors and customer interface. You will be responsible for delivering technical training to customers, help customers solve thermal challenges.
Responsibilities may include:
•	Proactively addresses thermal risk/issues of IC packaging.
•	Provide thermal solutions at architect, model, and design levels that meet both package and board level requirements 
•	Thermal modeling of package/system that provide high confidence thermal performance in all user conditions
•	Conduct packaging&system thermal testing and characterization.
•	Analyze thermal test/validation data and correlate to thermal modeling.
•	 Create new thermal innovations and evaluate the new thermal technologies.