长鑫存储封装设计工程师 I Package Design Engineer(J13430)
任职要求
1.Proficient in package substrate design 2.Proficient in EDA tools Candence, Zuken, etc. 3.Familiar with SIPI related high-speed PKG&PCB design requirements 4.Familiar with substrate design rule and substrate process. 5.At least 3 years experience in related industry. 6.Familar with Auto CAD etc. 7.Familar with DRAM PKG design is better. 8.Have great communication and teamwork skills. 9.Education requirement: Bachelor degree or above.
工作职责
1.According to MRD, product performance requirements and process capability, responsible for packaging scheme selection,adopt EDA tool design PKG substrate. 2.Have ability to early PKG feasibility for new device and feedback suggestion to related department. 3.Adopt Auto CAD to design POD and wirebonding and marking drawing. 4.Adopt EDA tool design Daisy chain PKG&PCB. 5.Optimizing Bump design, develop and optimizing Ball Map. 6.Collaborated closely with the substrate factory and make new design rule can meet mass production and high performance.
1. Responsible for design floor plan and bump layout of customer SoC and Silicon/Glass/RDL interposer, and escaping trace line to satisfy SerDes trace line for Signal Integrity and Power Integrity against customer's requirement. 2. Responsible for design of daisy chain to satisfy its design of experiment for advanced 2.5D package structure, cost and warpage specification. 3. Responsible for electrical pre-simulation analysis working with off-chip level of package based on RLC and S-parameter extracted how to optimize SoC SerDes with FCBGA and Silicon/Glass/RDL interposer level. 4. Leading design work of DFM (Design For Manufacturing), DFR (Design For Reliability), and DFP (Design For Performance) with adjacent team and variant vendors. 5. Preparation/discussion/confirmation for unit drawing spec with variants carrier, bonding spec, and package of drawing with adjacent team and variant vendors. 6. Understanding result of signal integrity and power integrity from customer and external department, planning and doing DoE to satisfy with package design activity based on co-worked with adjacent team and variant vendors.
新型堆叠封装技术研究与专利提案 新型堆叠封装技术设计与规格制定 新型堆叠封装技术路线制定 实验讨论与分析 定义製程条件需求及製程规格 开发进程管控与结项 新型堆叠封装技术Design rule制定
堆叠前沿技术研究与Pre-learning 堆叠封装方案与专利提案 堆叠先进技术路线制定 堆叠封装流程和结构设计 堆叠封装工艺风险分析,开发与整合 堆叠封装良率分析，并提供解决方案 制定堆叠封装工艺规范、品质规范 与OSAT讨论与商定堆叠工程设备、材料、参数 OSAT堆叠工程能力/品质管理评估
1.前端：用 Python（Django/FastAPI/Streamlit）或 Java（Spring Boot + Thymeleaf/前后端分离）快速开发可交付的Web应用； 2.后端：负责RESTful API、微服务、消息队列、任务调度，保障高并发、高可用； 3.数据层：MySQL/PostgreSQL/MongoDB 表设计、调优、备份、迁移，必要时编写ETL脚本； 4.AI 协同：与算法团队对接，把模型（PyTorch/TensorFlow）封装成在线推理服务（Docker + K8s + GPU），持续监控效果； 5.质量保障：单元/集成测试、CI/CD、灰度发布、性能压测、故障复盘。