长鑫存储技术转移工艺专家 | Transfer Process Expert(J17279)

1. 参与新产品的研发，工艺缺陷的定义和管理，设计开发制程检测方案； 2. 配合新工艺开发需要，评估、导入新设备，本土化设备导入及应用开发提升； 3. 工艺缺陷检测方案优化及改进,确保产线缺陷数据的真实,服务于产品工艺改善与良率提升； 4. 工艺缺陷问题及时侦测, 寻找root cause，并推动PE/PIE共同进行改善； 5. 运用统计学方法数据分析,优化缺陷数据分析系统,强化数据关联性,推动其智能化； 6. 协调跨部门合作，与量产部门合作，转移新研发的缺陷检测技术，确保成功量产。

1. 参与封装方案设计，负责芯片封装方案的DFM落地与竞争力 Participate in the Chip packaging solution design，and responsible for the DFM implementation and competitiveness of chip packaging solutions 2. 负责芯片封装相关NPI阶段生产制造及工程工艺质量保障，工艺失效分析及改进措施制定与落地，完成试产到量产的转移 Responsible for chip packaging related NPI manufacturing and engineering process quality assurance, process failure analysis, process improvement and implementation, and complete the transfer from NPI to SVM and HVM production 3. 负责芯片新材料、新封装技术应用的开发 Responsible for the development of new chip materials and new packaging technology applications 4. 负责定期组织供应商交流，梳理供应商能力，为封装方案设计提供能力支撑 Responsible for regularly organizing supplier exchanges (e.g. QTR), sorting out supplier capabilities, and providing capability support for packaging solution design 5. 通过技术维度支持供应链及采购体系维护有竞争力的供应商合作关系 Support the supply chain and procurement system through the technical dimension to maintain a competitive supplier partnership

1. 参与封装方案设计，负责芯片封装方案的DFM落地与竞争力 Participate in the Chip packaging solution design，and responsible for the DFM implementation and competitiveness of chip packaging solutions 2. 负责芯片封装相关NPI阶段生产制造及工程工艺质量保障，工艺失效分析及改进措施制定与落地，完成试产到量产的转移 Responsible for chip packaging related NPI manufacturing and engineering process quality assurance, process failure analysis, process improvement and implementation, and complete the transfer from NPI to SVM and HVM production 3. 负责芯片新材料、新封装技术应用的开发 Responsible for the development of new chip materials and new packaging technology applications 4. 负责定期组织供应商交流，梳理供应商能力，为封装方案设计提供能力支撑 Responsible for regularly organizing supplier exchanges (e.g. QTR), sorting out supplier capabilities, and providing capability support for packaging solution design 5. 通过技术维度支持供应链及采购体系维护有竞争力的供应商合作关系 Support the supply chain and procurement system through the technical dimension to maintain a competitive supplier partnership

1. 在新technology 交付前6个月参与研发项目，将新技术转移到工厂 2. 将 product 的综合良率提升至相对成熟水平 3. 负责新平台衍生产品的开发工作，对产品交付负责 4. 负责产线缺陷问题的改善, 实现对新制程的良好监测, 确保产线缺陷数据的真实与稳定，服务于产品工艺与良率提升 5. 运用统计学方法数据分析,优化缺陷数据分析系统,强化数据关联性,推动其智能化； 6. 协调跨部门合作，与研发与量产部门合作，稳步降低defect yield loss。