平头哥平头哥-网络芯片设计专家-成都
任职要求
1、本科及以上,电子工程,微电子,通讯,计算机专业等优先; 2、具备两年以上数字芯片设计经验; 3、具备物理综合,时序分析与优化,形式验证,可验证性设计,低功耗设计等方面的经验; 4、具备泛网络类芯片,比如网卡芯片,交换机,路由器芯片设计经验优先; 5、富有激情,有创新意识和能力,具有良好的团队合作能力。 Skills and experience: 1. Bachelor degree or above, major in electronic engineering, microelectronics, communication, computer, etc. is preferred; 2. Have more than two years of e…
工作职责
1、负责和参与DPU芯片的应用场景与需求分析; 2、负责和参与DPU芯片架构方案的讨论与设计; 3、负责和参与DPU芯片各子系统微架构的方案设计与编码; 4、与验证团队协同完成芯片BUG收敛,包括芯片问题定位分析、Corner点识别和覆盖率分析等; 5、负责和参与模块的物理综合和设计。 Job responsibilities: 1. Be responsible for and participate in the analysis of application scenarios and requirements of DPU chips; 2. Be responsible for and participate in the discussion and design of DPU chip architecture; 3. Be responsible for and participate in the scheme design and coding of the microarchitecture of DPU chip subsystem; 4. Cooperate with the verification team to complete chip BUG convergence, including chip problem location analysis, Corner point identification and coverage analysis, etc; 5. Be responsible for and participate in the physical synthesis and design of modules.
1、负责和参与DPU芯片的应用场景与需求分析; 2、负责和参与DPU芯片架构方案的讨论与设计; 3、负责和参与DPU芯片各子系统微架构的方案设计与编码; 4、与验证团队协同完成芯片BUG收敛,包括芯片问题定位分析、Corner点识别和覆盖率分析等; 5、负责和参与模块的物理综合和设计。 Job responsibilities: 1. Be responsible for and participate in the analysis of application scenarios and requirements of DPU chips; 2. Be responsible for and participate in the discussion and design of DPU chip architecture; 3. Be responsible for and participate in the scheme design and coding of the microarchitecture of DPU chip subsystem; 4. Cooperate with the verification team to complete chip BUG convergence, including chip problem location analysis, Corner point identification and coverage analysis, etc; 5. Be responsible for and participate in the physical synthesis and design of modules.
1、负责和参与SNIC芯片的开发; 2、负责和参与芯片架构方案的讨论与可验证性分析; 3、负责和参与BT/IT/ST的验证,包括完成验证策略、测试点、验证方案、验证环境搭建等; 4、负责TC的开发与仿真执行,与设计团队一起bug收敛; 6、负责和参与门仿与后仿,确保门级功能与时序正确
1、参与智能网卡/DPU需求与应用场景讨论分析; 2、负责智能网卡/DPU芯片FW与驱动软件的方案设计,代码开发与调试; 3、参与智能网卡/DPU芯片的软硬件联合设计; 4、不断优化FW实现新的需求或性能优化;