苹果Thermal Product Design Engineer
任职要求
Key Qualifications • 3-5 years experience in thermal design of consumer electronics with a strong background in thermal systems/components and their manufacturing processes. • Experience with thermal testing and test equipment (DAQ, Wind tunnel, IR Camera, Power Supplies, …
工作职责
Responsibilities and activities for this position include the following: • Serve as Apple’s in-region thermal expert by leveraging a thorough understanding of the system-level and module-level thermal design and validation requirements. Experience in passive device thermal design is preferred. • Collaborate with U.S.-based Senior Thermal Engineers on technology evaluation, design investigation and process development for new products. • Guide and execute thermal testing at OEM and suppliers factories; Complete data reduction/analysis and prepare test reports. • Establish and manage relationships with thermal suppliers to identify emerging technologies and collaborate with them on the development of new technologies to meet Apple’s product roadmap needs. • Take the leading role in suggesting or adopting ideas for improving productivity and quality of thermal components. • Provide in-region expertise for root cause and corrective action of system thermal failures and defective thermal parts/materials. • Train engineers at OEM and vendor factories to produce high quality products using well-defined specifications, advanced production processes and update-to-date validation tools and codes.
THE ROLE Tesla is seeking a skilled and motivated mechanical design engineer in the Autopilot, Infotainment and Electronics Product Design team. The engineer will work closely with cross-functional stakeholders to perform mechanical design activities for Tesla vehicle systems, including to define product requirements and develop specific implementations. RESPONSIBILITIES Top to down modeling and design of mechanical components and sub systems including plastics, sheet metal, heat sinks, PCBs, I/O connectors, etc. Design analysis including parts, structural, design for assembly, and design for validation. Experience with failure analysis, root cause, and solution implementation internally and at contract manufacturer as well. Assist in engineering prototype quick builds and components fabrication. Complete validation tests, perform data analysis, brainstorm potential solutions and implement improved designs. Provide production support to help identify and resolve issues on site. Conduct Design for Manufacturing (DFM) reviews with suppliers and support tooling bring up
Position Summary We are seeking a innovative Power Electronics Hardware Engineer to join our core R&D team. You will lead the main topology design, component selection, and validation of power electronic converters for new power systems, guiding the product until its successful mass production. You will be a key contributor to achieving high performance, high reliability, and cost competitiveness in our products. Key Responsibilities 1. Main Circuit Design and Simulation: Responsible for the design, evaluation, and innovation of main power conversion topologies (e.g., AC/DC, DC/DC, DC/AC stages). Use simulation tools (e.g., PSPICE, LTspice, Saber, PLECS) for circuit simulation, including loop stability analysis, switching process analysis, and loss analysis, providing a theoretical basis for designs. Lead the design, calculation, and technical liaison with suppliers for key magnetic components (e.g., transformers, inductors). 2. Component Selection, Validation, and Lifespan Analysis: Responsible for the selection, evaluation, and testing of key components such as power semiconductors (IGBT, SiC MOSFET, GaN HEMT), capacitors, and magnetic components. Develop component validation test plans, and perform in-depth analysis of device characteristics, reliability, and potential failure modes. Conduct board-level power consumption and thermal analysis, collaborating with Structural/Thermal engineers to ensure system thermal design meets targets. 3. Board Design and Debugging: Lead or deeply participate in schematic design, and define PCB layout rules (especially for high-voltage, high-current, and sensitive signal sections). Guide Layout engineers to complete PCB design, ensuring it meets safety, EMC, thermal, and manufacturability requirements. Independently perform hardware board-level debugging, locate and resolve hardware issues, and conduct comprehensive validation of prototype performance and reliability. 4. Safety & EMC Design and Compliance: Strictly implement safety standards (e.g., UL 1741, IEC 62109) in hardware design, ensuring compliance with requirements like creepage and clearance distances. Consider EMC from the design source, formulate and implement EMC design schemes, and lead pre-compliance testing and troubleshooting/rectification during formal certification tests. 5. Test Validation and Production Transfer Support: Develop detailed hardware test plans, and execute design verification, system verification, and reliability testing. Analyze test data, write test reports, and be responsible for the completeness and accuracy of hardware design documentation. Support New Product Introduction (NPI), resolve hardware technical issues during pilot and mass production, and drive product design optimization and cost control. 职位概述 我们正在寻找一位富有创新精神的电力电子硬件工程师，加入我们的核心研发团队。您将主导新型电力系统中电力电子变换器的主拓扑设计、元器件选型与验证，直至产品成功量产。您是实现产品高性能、高可靠性及成本竞争力的关键力量。 主要职责 1. 主电路设计与仿真： 负责功率变换主拓扑的设计、论证与创新（如AC/DC, DC/DC, DC/AC等阶段）。 运用仿真工具（如PSPICE, LTspice, Saber, PLECS）进行电路仿真，包括环路稳定性分析、开关过程分析和损耗分析，为设计提供理论依据。 主导关键磁性元器件（如变压器、电感）的设计、计算与供应商技术对接。 2. 元器件选型、验证与寿命分析： 负责功率半导体（IGBT, SiC MOSFET, GaN HEMT）、电容、磁性元件等关键器件的选型、评估与测试。 制定元器件验证测试计划，深入分析器件特性、可靠性及潜在失效模式。 进行电路板的功耗与热分析，并与结构/散热工程师协作确保系统热设计达标。 3. 电路板设计与调试： 主导或深度参与原理图设计，制定PCB布局布线规则（特别是高压、大电流、敏感信号部分）。 指导Layout工程师完成PCB设计，确保其满足安规、EMC、散热及可制造性要求。 独立完成硬件单板调试，定位并解决硬件问题，对样机性能及可靠性进行全面验证。 4. 安规与EMC设计及合规性： 在硬件设计中严格贯彻安规标准（如UL1741, IEC62109），确保电气间隙、爬电距离等符合要求。 从设计源头考虑EMC问题，制定并实施EMC设计方案，主导产品前期预测试与正式认证测试的整改工作。 5. 测试验证与转产支持： 制定详细的硬件测试计划，完成设计验证、系统验证及可靠性测试。 分析测试数据，编写测试报告，并负责硬件设计文档的完整性与准确性。 支持新产品导入，解决试产及量产过程中的硬件技术问题，推动产品设计优化与成本控制。
• Design responsibility for the creation of new products designed around our GPUs, DPUs and CPUs to cover Graphics, Self-driving platform, Server, and Data center. • The LDE drives every aspect of design execution, initial test and bring-up, manages documentation required to release the product to manufacturing and partners, and is the main interface to the Silicon/Thermal/Mechanical/SI/EMC engineers. • The scope of the LDE role has been carefully tailored to allow these individuals to consistently deliver world class product quality on a SOL schedule, while applying great attention to detail and quality of execution. • Research the new feature/circuits and involve the establishment/discussion of industry standards, then implement them on the next generation product/platform design.
• Product thermal design and thermal/mechanical definition for next generation products. • Manage the development, specifications, design and manufacturing for your thermal solutions, i.e. heat sinks, interface materials, structures, fan, acoustics, thermally related ergonomics, enclosures, etc. • Prepare early design concepts and drive product thermally related design trade-offs • Research new materials, processes, and technologies to meet product goals • Support manufactory side thermal related issues debug and drive for solution. • Work with global team from concept design to manufacture and quality issue.