苹果Manufacturing Quality Engineer

1. R&D Operations Strategy and Planning - Develop and implement comprehensive R&D operations strategies, plans, and processes that align with the company's overall business objectives in the automotive sector. - Forecast resource requirements, including personnel, equipment, and budget, for R&D projects based on product development roadmaps and market demands. - Create and manage the annual R&D operations budget, ensuring efficient allocation of funds and cost control throughout the department. 2. Operation Project Management and Coordination - Oversee the planning, execution, and delivery of multiple operation projects simultaneously. Define project scopes, set milestones, and establish timelines to ensure on-time completion. - Coordinate with cross-functional teams, including engineering, design, purchase, admin, HR, finance to ensure strong support to R&D activities with other business functions. - Facilitate communication and collaboration among project teams, stakeholders, and external partners, ensuring clear and timely information flow. 3. HR Management - Collaborate with HR to develop and implement training and career development programs tailored to the needs of the R&D team. - Foster a culture of innovation, collaboration, and continuous learning within the R&D department, encouraging team members to explore new ideas and technologies. - Resolve conflicts and manage team dynamics effectively to maintain a positive and productive work environment. 4. Financial Management - Work closely with the finance department to develop and manage the R&D budget. Monitor and control expenses, ensuring that all spending aligns with budgetary constraints and financial targets. - Analyze financial data related to R&D projects, such as cost overruns, return on investment, and cost-benefit ratios. Provide financial insights and recommendations to senior management to support decision-making. - Participate in the preparation of financial reports and forecasts for the R&D department, ensuring accuracy and compliance with financial regulations. 5. Supplier Management - Establish and maintain strong relationships with suppliers of R&D materials, equipment, and services. Collaborate with the procurement department to develop supplier strategies, negotiate contracts, and manage supplier performance. - Evaluate suppliers based on quality, cost, delivery, and innovation capabilities. Conduct regular supplier audits and performance reviews to ensure compliance with company standards and expectations. - Identify potential suppliers and new sourcing opportunities to support R&D projects. Drive continuous improvement in supplier performance through supplier development initiatives. 6. Resource Management - Allocate and manage resources, including personnel, equipment, and facilities, to support R&D projects effectively. Ensure optimal utilization of resources and minimize waste. - Coordinate with procurement and logistics teams to acquire necessary materials, equipment, and services in a timely manner. - Manage the maintenance and upgrade of R&D facilities and equipment to ensure they meet the requirements of current and future projects. 7. Facilities Management - Oversee the planning, design, and construction of R&D facilities, ensuring they are equipped with the necessary infrastructure and technology to support research and development activities. - Manage the day-to-day operations of R&D facilities, including maintenance, security, and environmental management. Ensure compliance with relevant regulations and standards. - Plan for future facility expansion and upgrades based on the growth and needs of the R&D department.

1. 参与封装方案设计，负责芯片封装方案的DFM落地与竞争力 Participate in the Chip packaging solution design，and responsible for the DFM implementation and competitiveness of chip packaging solutions 2. 负责芯片封装相关NPI阶段生产制造及工程工艺质量保障，工艺失效分析及改进措施制定与落地，完成试产到量产的转移 Responsible for chip packaging related NPI manufacturing and engineering process quality assurance, process failure analysis, process improvement and implementation, and complete the transfer from NPI to SVM and HVM production 3. 负责芯片新材料、新封装技术应用的开发 Responsible for the development of new chip materials and new packaging technology applications 4. 负责定期组织供应商交流，梳理供应商能力，为封装方案设计提供能力支撑 Responsible for regularly organizing supplier exchanges (e.g. QTR), sorting out supplier capabilities, and providing capability support for packaging solution design 5. 通过技术维度支持供应链及采购体系维护有竞争力的供应商合作关系 Support the supply chain and procurement system through the technical dimension to maintain a competitive supplier partnership

1. 参与封装方案设计，负责芯片封装方案的DFM落地与竞争力 Participate in the Chip packaging solution design，and responsible for the DFM implementation and competitiveness of chip packaging solutions 2. 负责芯片封装相关NPI阶段生产制造及工程工艺质量保障，工艺失效分析及改进措施制定与落地，完成试产到量产的转移 Responsible for chip packaging related NPI manufacturing and engineering process quality assurance, process failure analysis, process improvement and implementation, and complete the transfer from NPI to SVM and HVM production 3. 负责芯片新材料、新封装技术应用的开发 Responsible for the development of new chip materials and new packaging technology applications 4. 负责定期组织供应商交流，梳理供应商能力，为封装方案设计提供能力支撑 Responsible for regularly organizing supplier exchanges (e.g. QTR), sorting out supplier capabilities, and providing capability support for packaging solution design 5. 通过技术维度支持供应链及采购体系维护有竞争力的供应商合作关系 Support the supply chain and procurement system through the technical dimension to maintain a competitive supplier partnership

芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.