苹果Product Design Engineer - SiP NPI

工作描述

Qualifications
Minimum Qualifications
M.S degree in mechanical engineering, physics, materials science or equivalent, with a minimum of 3 years of experience in IC packaging (for Bachelor, minimum 5 years experience is required)

General knowledge / experience in overall SiP process, panel level packaging process or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin film materials.



Preferred Qualifications
Extensive experiences about transfer molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor/packaging/electronics manufacturing

Proven ability to lead internal or external team for assembly process development and qualification of s…