苹果DFM Engineer- SiP NPI

工作描述

Qualifications
Minimum Qualifications
M.S degree in mechanical engineering, physics, materials science or equivalent, with minimum 5 years of experience in IC packaging (for Bachelor, 10 years above experience is required).

General knowledge / experience in overall SiP process, panel level or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin-film materials.

Excellent interpersonal skills with both Mandarin & English.


Preferred Qualifications
Extensive experiences about transferring molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor / packaging / electronics manufacturing.

Proven track record of leading internal or external team for assembly process development and qualification of semiconductor packages.

Good understanding and skill for materia…