特斯拉Test Development Engineer 测试开发工程师
任职要求
• Experience with Python development in Linux • Hands-on experience designing and debugging electronics • Lean Six Sigma, GRR, and problem solving skills • Understand electrical products test manufacturing process and test coverage across different machines • Cost conscious and able to continuously improve both hardware and software frameworks • Ability to travel across APAC to onside support contract manufacturers Extra Points • Engineering experience in EE/CE or equivalent with 2 or more years developing testers for harsh production environment • LabView and Teststand experience • Able to rework surface mount components • PCBA design and embedded firmware development …
工作职责
Tesla Electronics Test and Automation Group (ETAG) is the main point of contact to ensure the highest quality vehicle, silicon and robotics electronics for our customers. Our mission is to develop test automation equipment, architect software automation framework, and provide hardware/software/data infrastructure for Tesla electronics communities worldwide. We are seeking an engineer to design Manufacturing Test Equipment for low voltage electronic hardware. Automated functional testers will be deployed at Tesla factories and contract manufacturers worldwide. This team concentrates on mechanical, electrical and software design of reliable testers and tools for all production vehicles. We are looking for makers, self-motivated people who love tinkering and get satisfaction from manifesting ideas into real tangible things. Project timelines can be as short as a few weeks, producing equipment to test and assist in the assembly of the vehicle programs on the bleeding edge of Tesla’s innovation. This is an opportunity to be a part of the “machine that builds the machine.” Responsibilities • Design and develop automated test equipment for functional test of low Voltage automotive modules • Create Production test specification for electronic hardware • Create, read, interpret, and diagnose schematics, wiring diagrams, and circuits • Create test software to communicate with test equipment such as power supply, signal generators, DAQ, spectrum analyzer • Develop software drivers and framework to interface with automotive modules using CAN, LIN, Ethernet & USB • Confer and collaborate with cross functional teams, such as hardware, firmware, factory process, and quality teams • Support bring up, validation, and development of new hardware and systems at suppliers • Sustain existing testers at suppliers
图研发团队负责美图系列产品的全链路技术开发与中台体系建设。我们聚焦AI影像、多端协同与数据智能，用扎实的技术将创意转化为稳定优美的亿级用户产品体验。期待你加入，用代码赋能创意。 Our R&D Team drives full-stack development for Meitu's product suite and platform infrastructure. Specializing in AI imaging, multi-end collaboration, and data intelligence, we turn ideas into stable, elegant experiences for millions of users. Join us to code the future of creativity. 岗位名称：测试开发工程师 工作地点：厦门 岗位职责： ● 参与Windows / Mac / Android / iOS 平台下的自动化测试和专项测试的相关工作 ● 追踪并分析线上线下故障，推动问题的合理解决，提升项目质量 ● 根据公司产品特点和业务需求，对测试工具和方式进行优化，包括但不限于研发和维护内部工具、平台、系统和框架 ● 学习和研究新技术并落地以提高测试效率和质量
我们寻求一位积极进取的实践工程师，加入制造测试工程团队的职位，该团队专注于为特斯拉的产品创建强大，美观，以数据为中心的生产测试设备 · 根据产品研发的需求，与产品团队共同确定测试系统硬件架构及方案。 · 深入理解产品并完成测试系统电气设计，包括测试系统方案制定，设备选型，优化等相关工作。 · 使用软件编程，创建，记录，调试程序，编写组织化、结构化、文档化、可维护及可重用的代码； · 基于电路图纸及软件代码，对测试设备进行调试及故障排查。 · 优化自动化生产流程，以最大限度地减少生产周期并维持设备正常运行； · 使用基于数据驱动的统计方法（如GageR&R和Cpk）进行设备验证； · 对测试异常结果分析，确认产品失效或解决测试设备故障 · 主持并参与针对生产测试设备的设计审查；
芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.
芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.