特斯拉测试开发工程师，制造测试工程 Test Development Engineer, Manufacturing Testing Engineering

芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.

芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.

芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.

Position Summary We are seeking a innovative Power Electronics Hardware Engineer to join our core R&D team. You will lead the main topology design, component selection, and validation of power electronic converters for new power systems, guiding the product until its successful mass production. You will be a key contributor to achieving high performance, high reliability, and cost competitiveness in our products. Key Responsibilities 1. Main Circuit Design and Simulation: Responsible for the design, evaluation, and innovation of main power conversion topologies (e.g., AC/DC, DC/DC, DC/AC stages). Use simulation tools (e.g., PSPICE, LTspice, Saber, PLECS) for circuit simulation, including loop stability analysis, switching process analysis, and loss analysis, providing a theoretical basis for designs. Lead the design, calculation, and technical liaison with suppliers for key magnetic components (e.g., transformers, inductors). 2. Component Selection, Validation, and Lifespan Analysis: Responsible for the selection, evaluation, and testing of key components such as power semiconductors (IGBT, SiC MOSFET, GaN HEMT), capacitors, and magnetic components. Develop component validation test plans, and perform in-depth analysis of device characteristics, reliability, and potential failure modes. Conduct board-level power consumption and thermal analysis, collaborating with Structural/Thermal engineers to ensure system thermal design meets targets. 3. Board Design and Debugging: Lead or deeply participate in schematic design, and define PCB layout rules (especially for high-voltage, high-current, and sensitive signal sections). Guide Layout engineers to complete PCB design, ensuring it meets safety, EMC, thermal, and manufacturability requirements. Independently perform hardware board-level debugging, locate and resolve hardware issues, and conduct comprehensive validation of prototype performance and reliability. 4. Safety & EMC Design and Compliance: Strictly implement safety standards (e.g., UL 1741, IEC 62109) in hardware design, ensuring compliance with requirements like creepage and clearance distances. Consider EMC from the design source, formulate and implement EMC design schemes, and lead pre-compliance testing and troubleshooting/rectification during formal certification tests. 5. Test Validation and Production Transfer Support: Develop detailed hardware test plans, and execute design verification, system verification, and reliability testing. Analyze test data, write test reports, and be responsible for the completeness and accuracy of hardware design documentation. Support New Product Introduction (NPI), resolve hardware technical issues during pilot and mass production, and drive product design optimization and cost control. 职位概述 我们正在寻找一位富有创新精神的电力电子硬件工程师，加入我们的核心研发团队。您将主导新型电力系统中电力电子变换器的主拓扑设计、元器件选型与验证，直至产品成功量产。您是实现产品高性能、高可靠性及成本竞争力的关键力量。 主要职责 1. 主电路设计与仿真： 负责功率变换主拓扑的设计、论证与创新（如AC/DC, DC/DC, DC/AC等阶段）。 运用仿真工具（如PSPICE, LTspice, Saber, PLECS）进行电路仿真，包括环路稳定性分析、开关过程分析和损耗分析，为设计提供理论依据。 主导关键磁性元器件（如变压器、电感）的设计、计算与供应商技术对接。 2. 元器件选型、验证与寿命分析： 负责功率半导体（IGBT, SiC MOSFET, GaN HEMT）、电容、磁性元件等关键器件的选型、评估与测试。 制定元器件验证测试计划，深入分析器件特性、可靠性及潜在失效模式。 进行电路板的功耗与热分析，并与结构/散热工程师协作确保系统热设计达标。 3. 电路板设计与调试： 主导或深度参与原理图设计，制定PCB布局布线规则（特别是高压、大电流、敏感信号部分）。 指导Layout工程师完成PCB设计，确保其满足安规、EMC、散热及可制造性要求。 独立完成硬件单板调试，定位并解决硬件问题，对样机性能及可靠性进行全面验证。 4. 安规与EMC设计及合规性： 在硬件设计中严格贯彻安规标准（如UL1741, IEC62109），确保电气间隙、爬电距离等符合要求。 从设计源头考虑EMC问题，制定并实施EMC设计方案，主导产品前期预测试与正式认证测试的整改工作。 5. 测试验证与转产支持： 制定详细的硬件测试计划，完成设计验证、系统验证及可靠性测试。 分析测试数据，编写测试报告，并负责硬件设计文档的完整性与准确性。 支持新产品导入，解决试产及量产过程中的硬件技术问题，推动产品设计优化与成本控制。