特斯拉测试开发工程师，制造测试工程 Test Development Engineer, Manufacturing Testing Engineering

芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.

芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.

芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。 As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package structure, heat dissipation, BOM material, and manufacturing process all affect chip performance, cost, and application reliability. As a packaging engineer, you will be dedicated to the design, development, manufacture, testing, verification, failure analysis, and technological innovation of the industry's highest-end chip packaging solutions. Here, you can understand and acquire the relevant knowledge and skills of the most advanced chip packaging technology, and work with the industry's top engineers to jointly develop the most advanced packaging technology and promote its continuous development. 工作职责RESPONSIBILITIES: 作为可靠性测试验证工程师，负责IC可靠性测试方案的制定与设计，保证芯片可靠性测试验证的顺利开展以支撑芯片及产品的开发及量产应用 Work as a Reliability Test and Verification Engineer, define reliability solution and its corresponding hardware design, to ensure reliability test and verification tasks to support the development and mass production of chips and products. 负责芯片及产品相关的失效分析、可靠性寿命评估，并针对失效分析结果联合上下游团队提出适当的解决方案 Responsible for failure analysis and reliability life assessment to chips and products, and work with up/down-stream teams to propose appropriate solutions based on failure analysis results 构建并不断完善可靠性测试流程、系统，支撑公司产品交付 Build and continuously improve the reliability test process and system to support the company's product delivery 从效率、成本等角度对可靠性测试方法、方案开展持续改进及优化，保证产品测试质量的基础上，不断提升可靠性测试竞争力 Continuous improvement and optimization of reliability test methods and solutions from the perspectives of efficiency and cost, and continuously improve reliability test competitiveness on the basis of ensuring product test quality. 跟踪行业技术趋势，开展可靠性寿命评估模型及方法的研究，应对新工艺制程、新结构、新材料的挑战 Track on the industry trend, perform research on reliability life assessment models and methodology, to addressing challenge on new process, new structure and new material.

团队简介： 不同于广大企业依靠供应商完成产线测试系统设计和制造，特斯拉各个核心电池产品（车用电池，电池电子器件，超级充电站，家用/工业储能电池，太阳能屋顶）测试都由内部团队开发。核心测试团队负责以极小成本，最先进的测试技术完成最复杂的测试，为特斯拉产品的各个生产环节层层把关，确保用户收到高质量的产品。我们正在寻找一位与我们一样对不断提升测试技术，对推动世界向可持续能源转变充满激情的测试技师加入我们的团队。 · 完成测试设备调试与问题排查并指导测试技术员完成调试任务 · 深入理解测试系统电气设计 · 维护测试设备，记录和分析测试数据，报告测试过程中发现的问题，并与测试工程师紧密合作解决这些问题 · 支持测试/验证计划和方法的开发，以确保被测试件能够满足可靠性、结构和其他工程目标