ASMLElectron Optics Simulation Data Processing Engineer

You will be responsible for crafting and developing industry leading optical calibration and metrology systems for testing optical modules and components (e.g. display panels and much more), during NPI (new product introduction) stage, with the supports from SW/HW multi-functional teams. Initiate, explore, prototype and deploy new technology for module and key optical component testing to support product design and development. Provide technical assessments of vendor capability, tester manufacturing feasibility, and validate and influence supplier’s technical specification to fulfill design requirements and key performance matrix characterization bring up. Define calibration & measurement Engineering Requirement Specification (ERS) for optical instruments and automated systems. Conduct HW/SW validation and FA for metrology instruments and systems. Deep dives in new tester prototyping, FA, scale up through simulation, design of experiments, data analysis and technical benchmarking (Gauge R&R process). Involved in tester related component, module and system level process, design and spec funneling to enable manufacturability in high volume. Champion new technology transfer to manufacturing partners from research/pilot line to ensure scalability. Provide crisp and thorough presentation and report, on subjects listed above. And connect with a broad range of multi-functional teams.

In this role, you will be responsible for the complete design and development of photonic integrated circuits, based on established optical PDKs from our foundry partners. You will also interact with device, hardware, and software design teams to assist in the overall development of photonic systems, specifying, selecting, and qualifying the various components necessary. ● Design, layout and test high-performance photonics devices suitable for high-volume manufacturing ● Contribute and own large-scale photonic layouts for high-volume products ● Actively collaborate across disciplines, with analog, digital, and physical design teams to tape-out products and characterization devices. ● Work with the photonics test team in defining requirements for device characterization, debug and validation ● Works on broader organizational projects that require a thorough understanding of photonics ● Analyze characterization data to ensure the device/system meets the specifications ● Mentor junior design engineers

The candidate will be the major interface to the optical IO analog/mixed signal design team or vendor. As a member of the analog team, you’ll collaborate with our architects and engineers to develop innovative high speed analog transceiver solutions for next-generation optical and wireline communication systems. * We are currently hiring for multiple levels for this role. Your level and compensation will be determined by your experience, education, and location. ● Design analog/mixed-signal blocks with a focus on transceivers and broadband circuits interfacing with silicon photonics elements such as trans-impedance amplifiers (TIA) and Tx Driver ● Contribute to the development of complex SoC integration flows, with a strong focus on high-speed circuit design and advanced node integration. You will work closely with photonics and 3DIC packaging teams to co-develop solutions for leading-edge products ● Support micro-architecture development with chip architects by conducting feasibility studies ● Collaborate with members of our design engineering teams (system, digital, analog, photonics) to define electrical requirements ● Drive block-level floorplan, mask design views, and their reviews ● Run post-layout and mixed-signal top-level simulations to validate integration ● Define production and bench-level test plans ● Validate performances of the circuits in the lab ● Mentor junior design engineers

Job DescriptionThe Head of China Program is an executive role, effectively serving as the leader of ASML HMI’s business in China and a member of the ASML’s China management team. In this capacity, you will lead the full spectrum of operations and strategy, driving the achievement of ambitious business goals and shaping the future of ASML’s HMI division in China. This role requires an experienced leader who can articulate and reinforce ASML’s mission, values, and strategic direction, while providing management and direction across a dynamic, rapidly evolving market. Reporting directly to the Head of BL Applications, the Head of China Program will oversee Development & Engineering, Advanced Technology Development, Product Management, and Roadmap implementation. You will be accountable for market leadership in e-beam inspection and metrology — covering such key applications as electrical defect and physical defect inspection —spanning the entire installed base in China, new system deliveries, and the development of roadmap products tailored specifically for the China market. Customer engagement is absolutely essential for success in this role. You are expected to establish and sustain strong, trust-based relationships with HMI customers in China, actively engaging with them to understand needs, pain-points, and opportunities for innovation. Your ability to listen, connect, and collaborate will define the effectiveness and reputation of the China Program. In addition, it is essential for the Head of China Program to coordinate closely with other BL Applications activities in China, including MPC and Brion, and other ASML sectors including CT account teams and customer support (CS). Leveraging synergies and fostering alignment across all BL Applications activities will be crucial to maximizing value, driving innovation, and ensuring strategic coherence for ASML’s business in China. Role and ResponsibilitiesExecutive leadership of ASML HMI’s business in China and serving a member on ASML’s China management team. Lead strategy execution for the HMI China Program, ensuring delivery of business and technology objectives. Drive the development, deployment, and support of HMI e-beam inspection and metrology products Oversee products spanning the entire installed base in China, new system deliveries, and China-specific roadmap product developments. Oversee research, design, field support, sourcing, and repair/reuse activities to support business continuity and growth. Manage and empower direct reports, including HMI Beijing D&E and a China dedicated Product Team that includes PDM, Product Management, and System Engineering. Champion active customer engagement—building relationships, gathering feedback, and translating insight into product and support excellence. Collaborate closely with HMI Field staff (Sales, FAE, Apps, CS), D&E teams in Taiwan, the ASML China Customer Team to ensure seamless operations and unified strategic direction. Coordinate actively with other BL Applications functions and teams in China, such as MPC and Brion, seeking synergies and shared opportunities to amplify impact across all BL Applications activities. Monitor progress, budgets, and key performance indicators, reporting outcomes to senior leadership. Ensure robust compliance with export control regulations and maintain ethical, transparent business practices.