长鑫存储数字后端设计(J19610)
任职要求
学历要求：硕士
专业要求：微电子、集成电路工程、电子科学与技术、电子信息、物理电子、电路系统、电子工程、EE、EEE等半导体或集成电路相关专业
其他要求：
1.通过CET-6或具备同…工作职责
1.负责将综合后的网表通过自动布局布线流程转化为版图。 2.对PPA(performance/power/area)进行权衡和优化。 3.进行物理检查和修正，并对时序、功耗进行签核
1、负责完成从网表到GDSII的完整物理设计流程，包括布局规划、电源规划、时钟树综合、布局布线、时序收敛及物理验证。 2、负责芯片的功耗分析、电源完整性分析、信号完整性分析及优化。 3、与前端设计、DFT（可测试性设计）、综合等团队紧密协作，共同推动设计优化与性能提升。 4、参与针对先进工艺节点的技术评估，并进行PPA（性能、功耗、面积）优化。 5、参与开发或维护用于提升设计效率的自动化脚本与流程。
An exciting internship opportunity to make an immediate contribution to AMD's next generation of technology innovations awaits you! We have a multifaceted, high-energy work environment filled with a diverse group of employees, and we provide outstanding opportunities for developing your career. During your internship, our programs provide the opportunity to collaborate with AMD leaders, receive one-on-one mentorship, attend amazing networking events, and much more. Being part of AMD means receiving hands-on experience that will give you a competitive edge. Together We Advance your career! JOB DETAILS: THE ROLE: Work with talented colleague cross different sites in different countries, to achieve a goal of tapeout on time after all needed sign-off checks. You will be in key position of handling quality of gds delivered to foundry and AMD will provide you a great platform of learning most advanced silicon technologies and exhibiting your excellent skill and personalities. THE PERSON: Given that you will work with teams abroad, English communication skill is a must and team work is also important for our daily work. As a plus, dedicated and innovative sprit is welcomed. KEY RESPONSIBILITIES: Focus on physical verification like DRC, LVS, Antenna, ESD, Latch-up, PERC checks in projects to ensure allocated work can be done within target timeline, to finally make sure tapeout on time. Have chance to learn all PhyV related knowledge and thus have a clear overview of how a large SOC works and how it pass all required verifications till a successful tapeout. Will have chance to exhibit your innovative ideas of enhancing current work flow or creating new tools/flow to automate daily work to increase efficiency.
1、拆解业务问题并设计产品方案 完成业务访谈、流程梳理、需求拆解、MVP 定义、优先级判断和上线规划。 将业务问题转化为 PRD、流程图、数据口径、系统规则和产品需求。 2、推动 CRM、DMS、零售系统、渠道系统、销售运营系统、数据产品等能力在区域落地。 推动 AI 应用与数字化产品落地 3、在销售分析、库存预警、门店执行、知识问答、价格监控、竞品反馈和流程自动化等场景中引入 AI 应用。 协同总部产品、数据、研发、运营和区域业务团队，推动系统功能、数据看板、AI 工具从 MVP 到上线使用。 4、以业务结果为导向，持续跟踪采用率、数据质量、流程效率、库存周转、销售转化、门店执行等关键指标。
1.负责数字电路设计，包括SPEC的定义/电路设计/设计报告撰写以及仿真验证等 2.评估和优化前沿技术中的内存体系结构和方法 3.设计内存产品的IPS的全定制电路 4.模拟/验证和分析内存功能和性能 5.监督布局和验证过程,包括布局和布线，DRC/LVS 6.为硅调试产品工程提供支持