长鑫存储化学机械研磨工艺研发专家-TD CMP Process Expert(J14108)
任职要求
1. 教育背景与专业知识:硕士或博士学位,材料科学/化学/物理或相关工程领域,有半导体制造或CMP工艺专门研究经历者优先;
2. 行业与专业经验:具备8年以上CMP工艺开发或生产经验,熟悉半导体制造流程,有大型半导体公司工作经验者更佳;
3. 专业技能与资格:能独立完成CMP工艺优化与问题解决,熟悉Oxide/Poly/W/Cu/Carb…工作职责
1. 工艺研发与优化:主导CMP工艺的研发与优化,通过调整工艺参数确保产品平坦度及缺陷控制满足高精度制造需求; 2. 参数监控与良率提升:通过数据分析监控CMP过程中的关键参数,定位异常波动并制定改善方案,降低缺陷率并提升良率; 3. 故障排查与闭环:针对CMP工艺问题完成根因分析,提出并实施有效解决方案,推动问题闭环; 4. 技术指导与团队赋能:为研发团队提供CMP工艺技术指导,协助解决生产中的技术难题,并主导新员工的CMP专业培训,提升团队整体能力; 5. 跨部门技术推进:协同材料供应商及设备制造商,推动新材料、新工艺的应用验证与导入。
1.Responsible for new product CMP process technology research and development; 2.Work closely with design, device, process integration and reliability departments to meet electrical, reliability, yield and cost requirements of new product processes; 3.Responsible for the cooperative research and development, evaluation and development of new machines and new materials, and cooperate with the development and implementation of future technology development lines; 4.Responsible for seamless technology transfer with mass production to minimize new product launch cycle.
1. 工艺研发与优化:主导CMP工艺的研发与优化,通过调整工艺参数确保产品平坦度及缺陷控制满足高精度制造需求; 2. 参数监控与良率提升:通过数据分析监控CMP过程中的关键参数,定位异常波动并制定改善方案,降低缺陷率并提升良率; 3. 故障排查与闭环:针对CMP工艺问题完成根因分析,提出并实施有效解决方案,推动问题闭环; 4. 跨部门技术推进:协同材料供应商及设备制造商,推动新材料、新工艺的应用验证与导入。
1.Responsible for new product CMP process technology research and development; 2.Work closely with design, device, process integration and reliability departments to meet electrical, reliability, yield and cost requirements of new product processes; 3.Responsible for the cooperative research and development, evaluation and development of new machines and new materials, and cooperate with the development and implementation of future technology development lines; 4.Responsible for seamless technology transfer with mass production to minimize new product launch cycle.