长鑫存储化学机械研磨工艺研发工程师-TD CMP Process Engineer(J14109)

1.Responsible for new product CMP process technology research and development; 2.Work closely with design, device, process integration and reliability departments to meet electrical, reliability, yield and cost requirements of new product processes; 3.Responsible for the cooperative research and development, evaluation and development of new machines and new materials, and cooperate with the development and implementation of future technology development lines; 4.Responsible for seamless technology transfer with mass production to minimize new product launch cycle.

1.Responsible for new product CMP process technology research and development; 2.Work closely with design, device, process integration and reliability departments to meet electrical, reliability, yield and cost requirements of new product processes; 3.Responsible for the cooperative research and development, evaluation and development of new machines and new materials, and cooperate with the development and implementation of future technology development lines; 4.Responsible for seamless technology transfer with mass production to minimize new product launch cycle.

1. 工艺研发与优化：主导CMP工艺的研发与优化，通过调整工艺参数确保产品平坦度及缺陷控制满足高精度制造需求； 2. 参数监控与良率提升：通过数据分析监控CMP过程中的关键参数，定位异常波动并制定改善方案，降低缺陷率并提升良率； 3. 故障排查与闭环：针对CMP工艺问题完成根因分析，提出并实施有效解决方案，推动问题闭环； 4. 技术指导与团队赋能：为研发团队提供CMP工艺技术指导，协助解决生产中的技术难题，并主导新员工的CMP专业培训，提升团队整体能力； 5. 跨部门技术推进：协同材料供应商及设备制造商，推动新材料、新工艺的应用验证与导入。

1. 负责CMP工艺的开发与标准化，包括抛光液、研磨垫等关键耗材的选型与配方优化，确保工艺在不同材料层（如氧化物、金属铜、低K介质）上的选择性、去除速率和表面质量达到设计要求。 2. 运用PDCA循环和SPC统计过程控制方法，分析inline量测数据与缺陷分布，持续优化工艺参数，扩大工艺窗口，提升制程稳健性。 3. 配合需求，开展新型材料（如钴、钌）的CMP工艺研发，推动从实验室验证到量产导入的全流程落地。 4. 写工艺规范、作业指导书及培训材料，组织内部技术交流与新人带教，促进知识沉淀与团队能力提升。