理想汽车IC 验证工程师（通信/高速接口）

In this position, you will be a member of the IC packaging development team in Horizon. With your technical background in thermal engineering, you will be responsible for FCBGA/MCM/FOP thermal solution enablement including thermal simulation, thermal characterization and modeling calibration. You will also work with different teams to help setup thermal test platform if needed. As a key contributor in the IC packaging development team, you will work closely with partner groups and organizations, including OSAT, material vendors and customer interface. You will be responsible for delivering technical training to customers, help customers solve thermal challenges. Responsibilities may include: • Proactively addresses thermal risk/issues of IC packaging. • Provide thermal solutions at architect, model, and design levels that meet both package and board level requirements • Thermal modeling of package/system that provide high confidence thermal performance in all user conditions • Conduct packaging&system thermal testing and characterization. • Analyze thermal test/validation data and correlate to thermal modeling. • Create new thermal innovations and evaluate the new thermal technologies.

1、负责存储系统的指标，模拟电路架构和模块设计指标； 2、负责芯片顶层以及模块的电路设计与仿真； 3、指导版图工程师完成版图布局； 4、与器件/工艺团队沟通关键器件的需求； 5、协助测试工程师测试芯片以及找出失效原因； 6、负责设计报告等文档的撰写； 7、完成上级交代的其他工作。

1 负责财务数字化产品需求调研分析，整理数据，形成用户画像与需求文档，辅助产品功能规划。 2 承接税务提报的开票需求，参与产品原型设计，绘制原型图、撰写 PRD； 3 协助功能测试优化，跟进产品迭代，反馈并推动问题解决； 4 协助项目经理协调研发、设计等跨部门团队，跟进项目进度，保障产品上线； 5 分析发票产品竞品动态，输出分析报告，为产品策略提供参考； 6 拥抱AI学习最新动态和发展趋势，探索并应用AI能力为业务提效。

•与设计团队及3D Fab合作，确定芯片3D物理架构及其技术落地方式，完成产品结构设计和工艺选择； •与3D Fab 合作，设计和优化 3D 芯片工艺集成流程，确保技术方案满足项目要求和技术规格 •负责3D芯片的Tape out；沟通，评估并协调满足3D Fab，2D Fab等各方的技术需求 •负责3D芯片的技术开发，工程验证和量产导入； •负责3D工艺技术问题的监控解决及3D良率提升，持续改进； •负责3D 芯片新的物理架构和技术实现方案的探索；