平头哥平头哥-芯片可靠性测试验证专家/高级专家-深圳

工作描述

Qualifications
1.材料学、固态电子学、电子相关专业硕士及以上学历
Master degree or above on material science, solid-State Electronics, and electronics related.
2.3年以上可靠性测试验证经验，熟悉可靠性测试验证工作，包括但不限于环境可靠性实验、老化测试实验等，有可靠性验证方案开发、向量开发、老化测试机台调试经验者优先
3+ years’ experience in reliability testing and verification, familiar with reliability testing and verification work, including but not limited to environmental reliability test, aging test, etc., experience in reliability verification program development, vector development, and aging test machine debugging experience is preferred

工作地点：上海，深圳
Work location: Shanghai, Shenzhen

Duty
芯片产业进入后摩尔时代，芯片封装解决方案面临诸多挑战。封装的尺寸、结构、散热、BOM材料、制造工艺，共同影响芯片的性能、成本、以及应用可靠性。作为封装工程师，你将致力于业界最高端芯片封装解决方案的设计、开发、制造、测试、验证，失效分析以及技术创新。在这里，你可以了解并获得最先进的芯片封装技术知识及能力，并和业界顶尖的工程师一起，共同开发最先进封装技术，并推动其持续发展。
As IC industry enters the more than Moore era, chip packaging solutions are facing many challenges. Package size, package…