苹果Thermal Manufacturing Quality Engineer
任职要求
Minimum Qualifications
• MS degree or equivalent experience in Mechanical/Materials/Data Engineering is required, MBA / PhD degree is a plus.
• Experience with mechanical part development, design, and qualification
• Knowledgable about current state-of-art production processes of module assembly and inspection
Preferred Qualifications
• Hands-on experience with performance characterization techniques and reliability testing
• Experience developing processes quality plans, supplier quality management, inspection solutions, and driving correctiv…工作职责
Thermal Module Quality Engineers will be fearless leaders capable of working with multi-functional teams to identify risks, explore solutions, reach consensus and implement mitigations as quickly and efficiently as possible. You will evaluate dimensional, functional, and cosmetic challenges through statistical analyses to make data-driven decisions as well as: - Drive quality readiness at the factory for development builds and mass production. Drive all quality issues in development builds to timely closure. - Collaborate with design, engineering teams to set appropriate quality control/Inspection/metrology stations on the production line. Drive IQC, IPQC, OQC and ORT - Drive qualification efforts in a wide variety of areas such as metrology, function inspection, cosmetic during module assembly. - Perform failure analysis to understand thermal failure modes and implement preventive measures. - Lead quality related functions for a program and serve as a project manager to push efforts at supplier locations. - Write, assess, and audit validation tests both internally and at the vendors. - Drive vendor process performance improvements through objective measurements using yield gap analysis. - Drive inspection optimization
1、负责Low Power IP设计交付（AVS，Dvfs Handler等）； 2、负责SOC Low Power设计交付（Power Tree，UPF，Low Power Control，Thermal Control等）； 3、参与SOC功耗场景的定义和Power Target分解； 4、与设计人员合作完成芯片Power Optimization和Power Signoff； 5、参与构建Power Model。
1、负责Low Power IP设计交付（AVS，Dvfs Handler等）； 2、负责SOC Low Power设计交付（Power Tree，UPF，Low Power Control，Thermal Control等）； 3、参与SOC功耗场景的定义和Power Target分解； 4、与设计人员合作完成芯片Power Optimization和Power Signoff； 5、参与构建Power Model。
1、端到端负责字节跳动自研芯片的硅后EVB板级验证和芯片产品化量产导入支撑工作，对芯片的硅后验证质量负责； 2、负责片上互联与高速接口（包括不限于PCIe/UCIe/BoW/UALink/CXL/RDMA/NVLink/UEC等）、模拟/数模混合（Serdes/PHY）等模块的硅后板级验证工作，包括不限于Electrical Validation（EV）、Signal Integrity Validation（SIV）、BER Validation、RAS策略验证、协议一致性验证、系统裕量与稳定性验证等； 3、与相关团队和合作伙伴高效协作，完成验证策略/方案/计划制定、用例设计、验证执行、问题定位与攻关、结果分析和评估报告等。
1、端到端负责字节跳动自研芯片的硅后EVB板级验证和芯片产品化量产导入支撑工作，对芯片的硅后验证质量负责； 2、负责芯片硅后EVB板级验证工作，与相关团队和合作伙伴高效协作，完成EVB板级需求分析、验证策略/方案/计划制定、软件测试接口需求分析、软硬件验证环境搭建、用例设计、验证执行、问题定位与攻关、结果分析和报告等工作。