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苹果Camera Module Design Lead

社招全职Hardware地点:上海状态:招聘

任职要求


Minimum Qualifications
• BSc/MSc/PhD in relevant field (Electrical Engineering, Mechanical Engineering, Optics, Physics, Materials or equivalent).
• Able to communicate and convey ideas clearly and concisely.

Preferred Qualifications
• Ability to lead a multi-functional team of engineers and scientists with outstanding background and technical expertise through the R&D phase of product development from concept to mass production is a key requirement.
• Ability to influence other teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule are key requirements.
• The applicant will also be familiar with at least 3 of the skills listed below:
• Design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms.
• Electronic circuit and system design including power and signal integrity.
• Understanding of geometric optics and image quality evaluation including test charts, algorithms, and lighting.
• Image/depth sensor design or characterization.
• Compact module manufacturing processes such as sensor attachment, flex attachment, active alignment, etc.
• Failure analysis techniques such as optical microscopy, X-ray, CT scans or SEM.
• Demonstrated ability in root-cause and corrective-action analysis.
• Proficiency in statistical analysis, data reporting, and visualization.
• Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets.

工作职责


包括英文材料
R+
Ray+
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