苹果Packaging Product Design Engineer
任职要求
Minimum Qualifications 3 years of related industry experience BS degree with an emphasis in Mechanical Engineering or Packaging Science Experience working with 3D and 2D CAD Strong engineering fundamentals Ability to travel up to 20% to support engineering build activities, including finding the root cause for failures and solutions for issues that impede build progress Preferred Qualificat…
工作职责
Design and execute packaging architecture from initial prototypes to mass production with sustainable packaging materials Utilize 2D and 3D CAD to design and document all parts and assemblies -Ensure design meets performance requirements throughout its lifecycle by performing materials analysis, stress, and failure analyses Collaborate with cross-functional teams, including industrial design, hardware, environmental, operations, and technology groups, to refine and execute on the design of the packaging Build models and prototypes to articulate design concepts, evaluate functionality, and validate packaging performance Partner with internal manufacturing teams and external vendors to optimize designs for function, cosmetics, and manufacturability
THE ROLE: Candidates working in External Manufacturing Operations (Backend Engineering) are expected to actively engage suppliers and external manufacturers to achieve critical performance goals. These include project management, successful new product introductions, ensuring supplier manufacturing readiness, maintaining processes free from excursions, and fostering new capabilities.
THE ROLE: Candidates working in External Manufacturing Operations (Backend Engineering) are expected to actively engage suppliers and external manufacturers to achieve critical performance goals. These include project management, successful new product introductions, ensuring supplier manufacturing readiness, maintaining processes free from excursions, and fostering new capabilities.
In this position, you will be a member of the IC packaging development team in Horizon. With your technical background in thermal engineering, you will be responsible for FCBGA/MCM/FOP thermal solution enablement including thermal simulation, thermal characterization and modeling calibration. You will also work with different teams to help setup thermal test platform if needed. As a key contributor in the IC packaging development team, you will work closely with partner groups and organizations, including OSAT, material vendors and customer interface. You will be responsible for delivering technical training to customers, help customers solve thermal challenges. Responsibilities may include: • Proactively addresses thermal risk/issues of IC packaging. • Provide thermal solutions at architect, model, and design levels that meet both package and board level requirements • Thermal modeling of package/system that provide high confidence thermal performance in all user conditions • Conduct packaging&system thermal testing and characterization. • Analyze thermal test/validation data and correlate to thermal modeling. • Create new thermal innovations and evaluate the new thermal technologies.
1. 封装方案选型与设计：根据MRD、产品性能要求及工艺能力，主导封装方案选型，使用EDA工具完成PKG基板设计与芯片设计； 2. 早期封装可行性评估：对新器件进行早期封装可行性评估，并向相关部门反馈优化建议； 3. 工程图纸设计：使用设计工具完成POD、Wirebonding及Marking图纸的绘制； 4. Daisy Chain设计：使用EDA工具完成Daisy Chain PKG及PCB设计； 5. Bump与Ball Map优化：主导Bump设计与优化，开发并优化Ball Map方案； 6. 基板厂协同与量产规范：与基板厂紧密协作，确保新设计规则满足量产要求与高性能目标。