施耐德Digital, Design Engineer
任职要求
Requirements: - - Be familiar with electrical power system and protection - - Coding development with C++, Java, etc. - - Be familiar with coding quality tools like Klocwork, Squore etc. - - Mastering the protocols like IEC61850, IEC101/103/104, DNP3, Modbus, etc. - - Be familiar with wireless communication like Zigbee, NFC, LoRA etc. - - Basic knowledge ove…工作职责
Responsibility: - To build power distribution architecture with embedded digital solution to enhance: o Operation efficiency o Predict maintenance o Grids reliability etc. - Be able to create the application based on the architecture with selected sensors, data collector, control module, gateway, and SCADA. - Validate (test) to secure the quality of the application from a system view: o Coding quality o Application reliability, including functional test, limit test, boundary test, compatibility etc.) o Basic EMC knowledge to ensure the robustness of communication on site - Design the application with modular design concept, to ensure the flexibility of reuse
Change the world. Love your job. As a Digital IC Design Engineering intern, you'll architect new TI products and make our customers' visions a reality. You'll define, design, model, implement and document analog, digital, and RF integrated circuits (ICs). And, you'll have the opportunity to work in exciting areas like audio, imaging, high-speed, interface, clocking, medical, high volume linear, automotive, storage, power supply, battery management, linear power and many more. Some of your responsibilities will include, but will not be limited to: • Partnering with business teams and system engineering to develop mutually agreeable design specifications • Providing high-level analysis on chip architecture trade-offs to ensure spec compliance and superior performance at a competitive cost • Participating in design reviews and creating the necessary design and product documentation • Partnering on IC layouts to ensure a high-performance standard • Characterizing prototypes, developing test specifications and coordinating with test/product engineering to drive product releases • Driving behavioral models Put your talent to work with us as a Digital IC Design Engineer Intern! Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
- Write Micro-Architecture Definition/Writing Design Implementation Spec based on Flash memory feature requirements； - Write RTL coding for block or top level； - Do IP level synthesis / timing analysis / formality check / CDC check /Code coverage check； - Assist on Verification Engineer to complete module and top level simulation and verification; - Debug RTL/Gate Level waveform at module or top level; - Do Silicon debugging of the related module functionalities and provide ECO solution accordingly；
THE ROLE: AMD CAD team is part of Design Methodology team and be responsible to deliver differentiated ASIC implementation flows (from RTL to GDSII) for all AMD products. You'll be working with the global CAD team on physical design implementation flows (from netlist to GDSII) and focus on PPA push related areas.
1. SOC 芯片的顶层集成与布局规划，从Netlist 到GDS，包括Chip/block level Floorplan, 时序分析，时钟数综合，IR drop分析等自动布局布线设计。 2. 建立和优化RTL2GDS flow, 精通RTL2GDS flow的各种 INPUT File。（如netlist, sdc, LEF, LIB, tech file etc., 负责数字后端设计流程的维护和完善 3. 管理和跟踪block的后端状态，识别后端风险，提供解决方案并推动消除风险； 4. 主导推动解决芯片后端实现中的关键技术难题； 5. 主导开发和改进后端实现流程和规范； 6. 从后端实现角度为芯片架构定义和设计提供支撑和改进建议；