长江存储工艺整合研发工程师/专家(J13619)
任职要求
1.MS or PhD in Electrical Engineering, Physics, Material or other related technical field is required, or BS +10 years experience in engineering or related discipline
2.Familiar with semiconductor fabrication process, material, physics, device and concepts. 10+ years of Process Integration and/or Process Development desired
3.Prior experience in advanced semiconductor fab R&D or production, and new me…工作职责
1.Be responsible for the design and development of the device architecture of 3D NAND Flash, and deeply participate in the whole process from concept design to mass production. Utilize professional knowledge to carry out innovation at the architecture level, optimize the structure of memory cells, and improve storage density, performance and reliability. 2.Collaborate with the circuit design team to complete the efficient transformation from device physical characteristics to circuit logic, ensuring the compatibility and performance of the overall system. And increase the read and write speed and reduce power consumption. 3.Lead the research and application of new technologies, explore cutting-edge fields such as new materials and manufacturing processes, and provide technical support for the performance breakthrough of 3D NAND Flash. Through the research on industry trends, promote technological innovation and enhance product competitiveness. 4.Conduct in-depth analysis of the problems in the R&D process by using the knowledge of device physics and semiconductor processes, and put forward effective solutions. Use data analysis and modeling techniques to optimize device performance and ensure that products meet high-quality standards. 5.Lead/Participate in test chip tapeout for new memory technology development and product chip tapeout for production introduction 6.Interact with process module, material, simulation, device characterization and reliability group to optimize process flow, improve memory cell device performance and develop innovative solution to meet product requirement and qualification criteria 7. Drive cross-functional team including process module, device, product engineering, design, YE, YAE, TO, and Test to address process/technology gap and yield/margin issues
1.从事DRAM工艺制程研发工作,主要负责对上千种不同制程进行极高要求的整合，使之成为支撑各种DRAM产品的工艺技术平台。其中大部分的工作内容涉及到与产品设计部门，电学表征部门以及具体的制程研发工程师共同进行技术创新，以实现高水平的电学性能，可靠性能的终端产品要求。 2.对相关工艺改良，提升芯片良率。在深入了解和掌握各种电学参数，产品参数的基础上，对与各种由产品设计，制程控制引起的良率不良现象进行系统性的分析研究，并以此为基础通过多种数据分析，建立切实可行的良率提升路线图，推动DRAM从产品设计，制程研发，良率从零到一， 从一到一百的极限理想目标的靠近。 3.新产品及新工艺导入。 通过系统性了解新产品以工艺的整个流程， 从制程整合的角度领导整个产品和工艺从研发部门到生产部门的导入，同时在此过程中负责工艺整合的优化升级，达到提升电学性能，可靠性能以及良率的要求。
1.主导Panel设计开发、panel相关器件选型认证工作； 2.主导项目过程中Panel技术类相关问题的处理； 3.以模块专家角色对项目设计做专业评审，识别风险； 4.新建及维护panel设计规范、认证交付件模板、数据库； 5.牵头panel相关性能提升专案，提升对panel相关材料的认知； 6.牵头推动面板厂落实panel制程相关规范要求；
1.负责项目整合管理。 2.负责完成项目计划、文件等编制及其跟踪。 3.负责项目风险的识别、评估及动态管理。 4.完成项目各要素的变更管理及发布。 5.负责增程电动系统项目研发预算的编制、变更及日常维护管理。 6.负责项目日常管理及内外部沟通。 7. 负责项目阀点评审及交付物提交 8.审核项目资料归档的完整性。
1.熟悉Wafer on Wafer，Chip on Wafer，2.5D/3D工艺相关材料，合作开发新材料 2.新技术导入、工艺参数及操作规范的建立及维护、大量生产制程控制 3.依据工艺整合的需求，对工艺中存在的课题进行攻关，拓展工艺窗口，提升产品良率及性能 4.引入和评估新材料、新功能，并降低工艺成本 5.熟练使用各种质量管理工具和数据分析软件