理想汽车Power Module Process Expert
任职要求
Education/Experience：
1. Bachelor degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields;
2. More than 8 years of experience in power semiconductor packaging product development or technology research and development;
3. Experience in industry-leading product development and mass production is preferred;
4. Proficient in packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect;
5. Have successful experience in SiC module development, and those who develop products to achieve mass production status are preferred;
Knowledge：
1. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry;
2. Profound knowledge of key packaging processes & corresponding equipment, e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.
Skills and Competencies：
1. Proactive, with pioneering spirit and a good sense of internal and external client;
2. Passionate about engineering, with a strong spirit of innovation;
3. Good command of English written and oral communication skills，Chinese is a plus;
4. Excellent team coordination and communication skills.工作职责
1. Tracking SiC power module technology trends, defining power module process technology roadmap; 2. Leading team to complete pre-research of advanced process technologies, organize technical cooperation with universities and research institutes; 3. Leading team to develop advanced power module processes, output process files; 4. Support product development team to finish product development and import to factory for mass production; 5. Support mass production process teams to solve major process issues, improve reliability and yield.
1. Responsible for the development of power module electromagnetic and circuit models include Spice model, optimizing power module electrical design, chip selection, and solving difficult problems such as oscillation, current sharing, crosstalk, and circulation current; 2. Responsible for the thermal resistance simulation, flow resistance simulation and various working condition temperature simulations of the power module, and optimizing the thermal design of the power module, completing the development of the electrothermal coupling simulation model of the power module; 3. Leading the power module packaging process simulation such as warpage, thermal mechanical stress, mold flow simulation, optimizing power module design, tooling fixture solution and key process parameters; 4. Aim to find root cause for power module reliability issues using simulation method, and complete lifetime assessment model and DFR for power modules; 5. Leading the continuous optimization of the power module simulation platform, defining a fast, robust, and automated simulation workflow, improving model accuracy based on experimental results, and realizing product virtual design and digital engineering; 6. Responsible for tracking cutting-edge simulation theories and methods for power modules, and using AI and big data methods to accelerate power module design and process development.
1. Track industry technology trends and develop packaging technology roadmaps for power modules; 2. Responsible for power module product definition, develop power module product roadmap; 3. Leading the team to complete the pre-research of advanced packaging solutions, and organize technical cooperation with universities and research institutes; 4. Leading team to complete the technical development of advanced power module, output design and process files; 5. Support product development team to finish product development and import to factory for mass production.
Develop new test equipment and procedures for camera module validation and production test. Lead Apple vendor and X-functional teams to resolve critical electrical, signal and power integrity issues Lead implementation for camera sub-system with challenging component and system requirements. Develop electronic testing prototypes for new camera features and product concepts Optics / images processing and testing knowledge would be a plus.
Responsibilities and activities for this position include the following: • Serve as Apple’s in-region thermal expert by leveraging a thorough understanding of the system-level and module-level thermal design and validation requirements. Experience in passive device thermal design is preferred. • Collaborate with U.S.-based Senior Thermal Engineers on technology evaluation, design investigation and process development for new products. • Guide and execute thermal testing at OEM and suppliers factories; Complete data reduction/analysis and prepare test reports. • Establish and manage relationships with thermal suppliers to identify emerging technologies and collaborate with them on the development of new technologies to meet Apple’s product roadmap needs. • Take the leading role in suggesting or adopting ideas for improving productivity and quality of thermal components. • Provide in-region expertise for root cause and corrective action of system thermal failures and defective thermal parts/materials. • Train engineers at OEM and vendor factories to produce high quality products using well-defined specifications, advanced production processes and update-to-date validation tools and codes.