理想汽车Power Module Packaging Design Expert
任职要求
Education/Experience：
1. Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors;
2. More than 8 years of experience in power semiconductor packaging product development or technology research and development;
3. Experience in industry-leading product development and mass production is preferred.
4. Have successful experience in SiC module development, and those who develop products to achieve mass production status are preferred.
Knowledge：
1. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry;
2. Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN;
3. Profound knowledge of packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect;
Skills and Competencies：
1. Passionate about engineering, with a strong spirit of innovation;
2. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in the industry;
3. Familiar with power module design rules as well as simulation or structure design tools.
4. Proactive, with pioneering spirit and a good sense of internal and external client;
5. Good command of English written and oral communication skills，Chinese oral langarage preferred.工作职责
1. Track industry technology trends and develop packaging technology roadmaps for power modules; 2. Responsible for power module product definition, develop power module product roadmap; 3. Leading the team to complete the pre-research of advanced packaging solutions, and organize technical cooperation with universities and research institutes; 4. Leading team to complete the technical development of advanced power module, output design and process files; 5. Support product development team to finish product development and import to factory for mass production.
1. Responsible for the development of power module electromagnetic and circuit models include Spice model, optimizing power module electrical design, chip selection, and solving difficult problems such as oscillation, current sharing, crosstalk, and circulation current; 2. Responsible for the thermal resistance simulation, flow resistance simulation and various working condition temperature simulations of the power module, and optimizing the thermal design of the power module, completing the development of the electrothermal coupling simulation model of the power module; 3. Leading the power module packaging process simulation such as warpage, thermal mechanical stress, mold flow simulation, optimizing power module design, tooling fixture solution and key process parameters; 4. Aim to find root cause for power module reliability issues using simulation method, and complete lifetime assessment model and DFR for power modules; 5. Leading the continuous optimization of the power module simulation platform, defining a fast, robust, and automated simulation workflow, improving model accuracy based on experimental results, and realizing product virtual design and digital engineering; 6. Responsible for tracking cutting-edge simulation theories and methods for power modules, and using AI and big data methods to accelerate power module design and process development.
1. Tracking SiC power module technology trends, defining power module process technology roadmap; 2. Leading team to complete pre-research of advanced process technologies, organize technical cooperation with universities and research institutes; 3. Leading team to develop advanced power module processes, output process files; 4. Support product development team to finish product development and import to factory for mass production; 5. Support mass production process teams to solve major process issues, improve reliability and yield.
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