理想汽车Power Module Simulation Design Expert
任职要求
Education/Experience： 1. Bachelor degree or above, majoring in Material science, Microelectronics, Mechanical engineering, Electrical engineering, Power electronics or other related fields. 2. Above 10 years’ experience in power semiconductor product development, and at least 5 years of experience in power module thermal simulation, stress & reliability simulation, electrical simulation and mold flow simulation; Knowledge： 1. Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN; 2. Familiar with the power module packaging structure, electrothermal characteristics, packaging process (including welding process, bonding process, silver sintering process, mold transfer process, etc.) as well as dynamic, static and reliability testing methods and standards; Skills and Competencies： 1. Proficiency in using ANSYS HFSS/Maxwell/Q3D/PSpice/LTSpice/Comsol/FloEFD/Fluent/ANSYS mechanical/Moldex3D and Minitab/MATLAB/PYTHON for data processing and result analysis ; 2. Must have excellent negotiation and problem-solving skills，proactive and creative; 3. Proficient English communication and writing skills, excellent team coordination and communication skills.
工作职责
1. Responsible for the development of power module electromagnetic and circuit models include Spice model, optimizing power module electrical design, chip selection, and solving difficult problems such as oscillation, current sharing, crosstalk, and circulation current; 2. Responsible for the thermal resistance simulation, flow resistance simulation and various working condition temperature simulations of the power module, and optimizing the thermal design of the power module, completing the development of the electrothermal coupling simulation model of the power module; 3. Leading the power module packaging process simulation such as warpage, thermal mechanical stress, mold flow simulation, optimizing power module design, tooling fixture solution and key process parameters; 4. Aim to find root cause for power module reliability issues using simulation method, and complete lifetime assessment model and DFR for power modules; 5. Leading the continuous optimization of the power module simulation platform, defining a fast, robust, and automated simulation workflow, improving model accuracy based on experimental results, and realizing product virtual design and digital engineering; 6. Responsible for tracking cutting-edge simulation theories and methods for power modules, and using AI and big data methods to accelerate power module design and process development.
1. Track industry technology trends and develop packaging technology roadmaps for power modules; 2. Responsible for power module product definition, develop power module product roadmap; 3. Leading the team to complete the pre-research of advanced packaging solutions, and organize technical cooperation with universities and research institutes; 4. Leading team to complete the technical development of advanced power module, output design and process files; 5. Support product development team to finish product development and import to factory for mass production.
• Design responsibility for the creation of new products designed around our GPUs, DPUs and CPUs to cover Graphics, Self-driving platform, Server, and Data center. • The LDE drives every aspect of design execution, initial test and bring-up, manages documentation required to release the product to manufacturing and partners, and is the main interface to the Silicon/Thermal/Mechanical/SI/EMC engineers. • The scope of the LDE role has been carefully tailored to allow these individuals to consistently deliver world class product quality on a SOL schedule, while applying great attention to detail and quality of execution. • Research the new feature/circuits and involve the establishment/discussion of industry standards, then implement them on the next generation product/platform design.
1.Be responsible for the design and development of the device architecture of 3D NAND Flash, and deeply participate in the whole process from concept design to mass production. Utilize professional knowledge to carry out innovation at the architecture level, optimize the structure of memory cells, and improve storage density, performance and reliability. 2.Collaborate with the circuit design team to complete the efficient transformation from device physical characteristics to circuit logic, ensuring the compatibility and performance of the overall system. And increase the read and write speed and reduce power consumption. 3.Lead the research and application of new technologies, explore cutting-edge fields such as new materials and manufacturing processes, and provide technical support for the performance breakthrough of 3D NAND Flash. Through the research on industry trends, promote technological innovation and enhance product competitiveness. 4.Conduct in-depth analysis of the problems in the R&D process by using the knowledge of device physics and semiconductor processes, and put forward effective solutions. Use data analysis and modeling techniques to optimize device performance and ensure that products meet high-quality standards. 5.Lead/Participate in test chip tapeout for new memory technology development and product chip tapeout for production introduction 6.Interact with process module, material, simulation, device characterization and reliability group to optimize process flow, improve memory cell device performance and develop innovative solution to meet product requirement and qualification criteria 7. Drive cross-functional team including process module, device, product engineering, design, YE, YAE, TO, and Test to address process/technology gap and yield/margin issues
1. Tracking SiC power module technology trends, defining power module process technology roadmap; 2. Leading team to complete pre-research of advanced process technologies, organize technical cooperation with universities and research institutes; 3. Leading team to develop advanced power module processes, output process files; 4. Support product development team to finish product development and import to factory for mass production; 5. Support mass production process teams to solve major process issues, improve reliability and yield.