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平头哥平头哥-Thermal Design Engineer-上海

社招全职5年以上技术-芯片地点:上海状态:招聘

任职要求


1.	材料、动力工程及工程热物理、热能工程等相关专业硕士及以上学历
2.	必须具备传热学、热力学、材料科学等基础知识
3.	3年及以上热仿真设计经验,有Ansys、…
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工作职责


1.	作为散热解决方案设计师,基于芯片封装解决方案及散热环境开展芯片散热相关仿真评估,并指导芯片功耗设计和封装解决方案设计开展优化迭代,交付有竞争力的散热方案,同时针对芯片周边系统设计和散热环境提供优化建议,甚至散热解决方案,并推动优化措施的落地,保证芯片在系统中的应用。
2.	负责芯片散热特性的分析及测试验证
3.	对散热相关材料特性、散热结构开展测试验证,包括材料导热特性、结构界面接触热阻等,为热设计分析提供有效数据支撑
4.	与业界供应商、研究机构进行互动,跟踪行业趋势,推动新技术研发及应用
包括英文材料
学历+
相关职位

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社招5年以上技术-芯片

1. 作为散热解决方案设计师,基于芯片封装解决方案及散热环境开展芯片散热相关仿真评估,并指导芯片功耗设计和封装解决方案设计开展优化迭代,交付有竞争力的散热方案,同时针对芯片周边系统设计和散热环境提供优化建议,甚至散热解决方案,并推动优化措施的落地,保证芯片在系统中的应用。 2. 负责芯片散热特性的分析及测试验证 3. 对散热相关材料特性、散热结构开展测试验证,包括材料导热特性、结构界面接触热阻等,为热设计分析提供有效数据支撑 4. 与业界供应商、研究机构进行互动,跟踪行业趋势,推动新技术研发及应用

更新于 2026-03-23上海
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社招 技术

Position Summary We are seeking a innovative Power Electronics Hardware Engineer to join our core R&D team. You will lead the main topology design, component selection, and validation of power electronic converters for new power systems, guiding the product until its successful mass production. You will be a key contributor to achieving high performance, high reliability, and cost competitiveness in our products. Key Responsibilities 1. Main Circuit Design and Simulation: Responsible for the design, evaluation, and innovation of main power conversion topologies (e.g., AC/DC, DC/DC, DC/AC stages). Use simulation tools (e.g., PSPICE, LTspice, Saber, PLECS) for circuit simulation, including loop stability analysis, switching process analysis, and loss analysis, providing a theoretical basis for designs. Lead the design, calculation, and technical liaison with suppliers for key magnetic components (e.g., transformers, inductors). 2. Component Selection, Validation, and Lifespan Analysis: Responsible for the selection, evaluation, and testing of key components such as power semiconductors (IGBT, SiC MOSFET, GaN HEMT), capacitors, and magnetic components. Develop component validation test plans, and perform in-depth analysis of device characteristics, reliability, and potential failure modes. Conduct board-level power consumption and thermal analysis, collaborating with Structural/Thermal engineers to ensure system thermal design meets targets. 3. Board Design and Debugging: Lead or deeply participate in schematic design, and define PCB layout rules (especially for high-voltage, high-current, and sensitive signal sections). Guide Layout engineers to complete PCB design, ensuring it meets safety, EMC, thermal, and manufacturability requirements. Independently perform hardware board-level debugging, locate and resolve hardware issues, and conduct comprehensive validation of prototype performance and reliability. 4. Safety & EMC Design and Compliance: Strictly implement safety standards (e.g., UL 1741, IEC 62109) in hardware design, ensuring compliance with requirements like creepage and clearance distances. Consider EMC from the design source, formulate and implement EMC design schemes, and lead pre-compliance testing and troubleshooting/rectification during formal certification tests. 5. Test Validation and Production Transfer Support: Develop detailed hardware test plans, and execute design verification, system verification, and reliability testing. Analyze test data, write test reports, and be responsible for the completeness and accuracy of hardware design documentation. Support New Product Introduction (NPI), resolve hardware technical issues during pilot and mass production, and drive product design optimization and cost control. 职位概述 我们正在寻找一位富有创新精神的电力电子硬件工程师,加入我们的核心研发团队。您将主导新型电力系统中电力电子变换器的主拓扑设计、元器件选型与验证,直至产品成功量产。您是实现产品高性能、高可靠性及成本竞争力的关键力量。 主要职责 1. 主电路设计与仿真: 负责功率变换主拓扑的设计、论证与创新(如AC/DC, DC/DC, DC/AC等阶段)。 运用仿真工具(如PSPICE, LTspice, Saber, PLECS)进行电路仿真,包括环路稳定性分析、开关过程分析和损耗分析,为设计提供理论依据。 主导关键磁性元器件(如变压器、电感)的设计、计算与供应商技术对接。 2. 元器件选型、验证与寿命分析: 负责功率半导体(IGBT, SiC MOSFET, GaN HEMT)、电容、磁性元件等关键器件的选型、评估与测试。 制定元器件验证测试计划,深入分析器件特性、可靠性及潜在失效模式。 进行电路板的功耗与热分析,并与结构/散热工程师协作确保系统热设计达标。 3. 电路板设计与调试: 主导或深度参与原理图设计,制定PCB布局布线规则(特别是高压、大电流、敏感信号部分)。 指导Layout工程师完成PCB设计,确保其满足安规、EMC、散热及可制造性要求。 独立完成硬件单板调试,定位并解决硬件问题,对样机性能及可靠性进行全面验证。 4. 安规与EMC设计及合规性: 在硬件设计中严格贯彻安规标准(如UL1741, IEC62109),确保电气间隙、爬电距离等符合要求。 从设计源头考虑EMC问题,制定并实施EMC设计方案,主导产品前期预测试与正式认证测试的整改工作。 5. 测试验证与转产支持: 制定详细的硬件测试计划,完成设计验证、系统验证及可靠性测试。 分析测试数据,编写测试报告,并负责硬件设计文档的完整性与准确性。 支持新产品导入,解决试产及量产过程中的硬件技术问题,推动产品设计优化与成本控制。

更新于 2026-01-16上海
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社招感知

Role The Sensing Hardware Team is responsible for architecting, designing, validating and integrating state-of-the-art sensing technologies for all Tesla vehicles. The sensors we develop support ADAS (Autopilot), safety, HVAC, chassis and other subsystems. As a Sensor Hardware Design Engineer, you will be responsible for overall performance of the sensing system and its features at any point in the product life cycle, serve as the owner of a given sensing system to address any issues discovered from development through deployment, understand and debug hardware and software interactions from prototyping through product launch, and manage priorities and support a host of projects simultaneously. Responsibilities Drive the design and execution of sensing subsystems through the following: Specification generation: distill sensor product requirements into constraints and actionable engineering systems design discussions Collaboration: lead cross-functional sensor design discussions with electrical, software, supply chain, manufacturing, thermal, and mechanical teams Architecture definition: translate sensor design discussions into design documents in the form of system block diagrams, functional and performance

上海