苹果Failure Analysis Engineer
任职要求
Minimum Qualifications
• PhD or Master degree in Electrical Engineering, Semiconductor Engineering, Materials/Chemical Science, or a related field
• Minimum 2 years experience in electrical design or failure analysis related to consumer electronics, semiconductors
• Hands-on experience with at least one advanced failure analysis/debug tools, such as Oscilloscope, Lock-in Thermography (LIT), OBIRCH, EMMI, SAT, nano probe, etc.
• Fluent in English with strong communication skills, including the ability to seek direction, listen to feedback, and convey complex findings concisely and understandably
Prefe…工作职责
• Understand the failure background and design creative investigation plans • Conduct investigations, including but not limited to operating a variety of advanced electrical fault isolation tools • Report findings and actively participate in discussions and debates with colleagues to determine next steps, conclusions, and corrective actions • Present data in global meetings and executive reviews
1. Responsible for the development of power module electromagnetic and circuit models include Spice model, optimizing power module electrical design, chip selection, and solving difficult problems such as oscillation, current sharing, crosstalk, and circulation current; 2. Responsible for the thermal resistance simulation, flow resistance simulation and various working condition temperature simulations of the power module, and optimizing the thermal design of the power module, completing the development of the electrothermal coupling simulation model of the power module; 3. Leading the power module packaging process simulation such as warpage, thermal mechanical stress, mold flow simulation, optimizing power module design, tooling fixture solution and key process parameters; 4. Aim to find root cause for power module reliability issues using simulation method, and complete lifetime assessment model and DFR for power modules; 5. Leading the continuous optimization of the power module simulation platform, defining a fast, robust, and automated simulation workflow, improving model accuracy based on experimental results, and realizing product virtual design and digital engineering; 6. Responsible for tracking cutting-edge simulation theories and methods for power modules, and using AI and big data methods to accelerate power module design and process development.
1. Responsible for mechanical and electrical maintenance of distribution center equipment, including daily maintenance and servicing. 2. Record equipment failures, conduct analysis and summarization, implement improvement plans, and supervise operators' compliance with equipment operation procedures. 3. Manage spare parts inventory for distribution equipment, including spare parts requisition and procurement, ensuring spare parts are maintained at safe stock levels. 4. Conduct feasibility analysis and verification for new equipment and facilities, and participate in the installation, commissioning, and pre-acceptance of new equipment.
1. 参与封装方案设计，负责芯片封装方案的DFM落地与竞争力 Participate in the Chip packaging solution design，and responsible for the DFM implementation and competitiveness of chip packaging solutions 2. 负责芯片封装相关NPI阶段生产制造及工程工艺质量保障，工艺失效分析及改进措施制定与落地，完成试产到量产的转移 Responsible for chip packaging related NPI manufacturing and engineering process quality assurance, process failure analysis, process improvement and implementation, and complete the transfer from NPI to SVM and HVM production 3. 负责芯片新材料、新封装技术应用的开发 Responsible for the development of new chip materials and new packaging technology applications 4. 负责定期组织供应商交流，梳理供应商能力，为封装方案设计提供能力支撑 Responsible for regularly organizing supplier exchanges (e.g. QTR), sorting out supplier capabilities, and providing capability support for packaging solution design 5. 通过技术维度支持供应链及采购体系维护有竞争力的供应商合作关系 Support the supply chain and procurement system through the technical dimension to maintain a competitive supplier partnership
1. 参与封装方案设计，负责芯片封装方案的DFM落地与竞争力 Participate in the Chip packaging solution design，and responsible for the DFM implementation and competitiveness of chip packaging solutions 2. 负责芯片封装相关NPI阶段生产制造及工程工艺质量保障，工艺失效分析及改进措施制定与落地，完成试产到量产的转移 Responsible for chip packaging related NPI manufacturing and engineering process quality assurance, process failure analysis, process improvement and implementation, and complete the transfer from NPI to SVM and HVM production 3. 负责芯片新材料、新封装技术应用的开发 Responsible for the development of new chip materials and new packaging technology applications 4. 负责定期组织供应商交流，梳理供应商能力，为封装方案设计提供能力支撑 Responsible for regularly organizing supplier exchanges (e.g. QTR), sorting out supplier capabilities, and providing capability support for packaging solution design 5. 通过技术维度支持供应链及采购体系维护有竞争力的供应商合作关系 Support the supply chain and procurement system through the technical dimension to maintain a competitive supplier partnership