长鑫存储堆叠封装路径研究工程师 I ESPF Engineer(J13792)
社招全职研发技术类地点:上海状态:招聘
任职要求
1. Strong oral and written communication skills in English 2. CAD skills experienced with formal package drawings 3. Knowledge of package substrate technology with cored/coreless multiple layers 4. Knowledge of package wafer level package technology with multiple RDL layers 5. Knowledge of advanced and general package process assembly 6. Knowledge of 2.1/2.3/2.5/3D package structure even included conventional package 7. Allegro package design tool such as APD & SiP skill 8. Sigrity XtractIM, PowerSI, Ansys HFSS modeling skill, and ADS SIPI circuit skill 9. Generation package design rule experienced with co-worked adjacent team 10. Have good communication and teamwork skills with calm office manner 11. Generate advanced package design intellectual property of daisy chain and function package product excluded with copycat 12. Fastest turn-around time of design working to meet package product line up 13. Approaching activity with 5Whys question against problem 14. Define/Measure/Analyze/Improve/Control DMAIC mind
工作职责
堆叠前沿技术研究与Pre-learning 堆叠封装方案与专利提案 堆叠先进技术路线制定 堆叠封装流程和结构设计 堆叠封装工艺风险分析,开发与整合 堆叠封装良率分析,并提供解决方案 制定堆叠封装工艺规范、品质规范 与OSAT讨论与商定堆叠工程设备、材料、参数 OSAT堆叠工程能力/品质管理评估
包括英文材料
Assembly+
https://gpfault.net/posts/asm-tut-0.txt.html
The way I was taught x86 assembly at the university had been completely outdated for many years by the time I had my first class.
https://www.ic.unicamp.br/~pannain/mc404/aulas/pdfs/Art%20Of%20Intel%20x86%20Assembly.pdf
Amazing! You’re actually reading this. That puts you into one of three categories: a student who is being forced to read this stuff for a class.
https://www.youtube.com/watch?v=6S5KRJv-7RU
People over complicate EASY things. Assembly language is one of those things.
https://www.youtube.com/watch?v=gfmRrPjnEw4
Learn assembly language programming with ARMv7 in this beginner's course.
Allegro+
https://www.youtube.com/watch?v=iN5Aaqj1PSE
This video demonstrates how to associate an existing symbol with a part and assign a category to the part in Allegro System Capture.
https://www.youtube.com/watch?v=j03rJseMN94
Create a New Library and Symbol Using the Allegro X System Capture tool in DE-HDL Library mode.
相关职位
社招研发技术类
新型堆叠封装技术研究与专利提案 新型堆叠封装技术设计与规格制定 新型堆叠封装技术路线制定 实验讨论与分析 定义製程条件需求及製程规格 开发进程管控与结项 新型堆叠封装技术Design rule制定
更新于 2025-09-19

社招6年以上
1. 为新世代Nand/XtRAM产品、高带宽高算力3D先进封装产品研发晶圆磨划工艺,提供技术支持; 2. 为64DP/32DP/HDP/UFS/PoPt等高堆叠封装、超薄芯片应用中不断出现的超薄芯片相关的OS/DBO/Die Crack/3PB/TSM等技术难题解决提供技术支持,确保代工厂建立稳定的量产工艺流程; 3. 为后续世代封装产品研发培养技术型项目管理人员提供支持; 4. 为公司在先进封装领域建立专利优势提供支持。
更新于 2025-08-27
社招3年以上量产技术类
1.新设备(Wafer on Wafer,Chip on Wafer,2.5D/3D堆叠)导入/验证, 设备参数及操作规范的建立及维护 2.熟悉相关设备及原理,解决设备异常,维护并优化设备稳定性 3.对设备存在的问题进行优化以满足工艺和生产需求,达成最大产出及降低成本 4.熟练使用各种设备运维工具。
更新于 2025-09-19